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CY25100
Field- and Factory-Programmable Spread Spectrum Clock Generator for EMI Reduction
Features
* Wide operating output (SSCLK) frequency range -- 3-200 MHz * Programmable spread spectrum with nominal 31.5-kHz modulation frequency -- Center spread: 0.25% to 2.5% -- Down spread: -0.5% to -5.0% * Input frequency range -- External crystal: 8-30 MHz fundamental crystals -- External reference: 8-166 MHz Clock * Integrated phase-locked loop (PLL) * Field-programmable -- CY25100SCF and CY25100SIF, 8-pin SOIC -- CY25100ZCF and CY25100ZIF, 8-pin TSSOP * Programmable crystal load capacitor tuning array * Low cycle-to-cycle jitter * 3.3V operation * Commercial and Industrial operation * Spread Spectrum On/Off function * Power-down or Output Enable function
Benefits
* Services most PC peripherals, networking, and consumer applications. * Provides wide range of spread percentages for maximum electromagnetic interference (EMI) reduction, to meet regulatory agency electromagnetic compliance (EMC) requirements. Reduces development and manufacturing costs and time-to-market. * Eliminates the need for expensive and difficult to use higher-order crystals. * Internal PLL to generate up to 200-MHz output. Able to generate custom frequencies from an external crystal or a driven source. * In-house programming of samples and prototype quantities is available using the CY3672 programming kit and CY3690 (TSSOP) or CY3691 (SOIC) socket adapter. Production quantities are available through Cypress's value-added distribution partners or by using third-party programmers from BP Microsystems, HiLo Systems, and others. * Enables fine-tuning of output clock frequency by adjusting CLoad of the crystal. Eliminates the need for external CLoad capacitors. * Suitable for most PC, consumer, and networking applications * Application compatibility in standard and low-power systems * Provides ability to enable or disable spread spectrum with an external pin. * Enables low-power state or output clocks to High-Z state.
Logic Block Diagram
Pin Configuration
CY25100 8-pin SOIC/TSSOP
PLL with MODULATION CONTROL
RFB
3 XIN CXIN 2 XOUT CXOUT
1 VDD
6 REFCLK
SSON# 8 SSCLK 7 REFCLK 6
PROGRAMMABLE CONFIGURATION
OUTPUT DIVIDERS and MUX
2
XOUT
3 XIN/CLKIN
7
4 PD# or OE 8 SSON# 1 VDD 5 VSS
SSCLK
4 PD#/OE
VSS 5
Cypress Semiconductor Corporation Document #: 38-07499 Rev. *D
*
3901 North First Street
*
San Jose, CA 95134 * 408-943-2600 Revised March 24, 2004
CY25100
Pin Description
Pin 1 2 3 4 VDD XOUT XIN/CLKIN PD#/OE Name 3.3V power supply. Crystal output. Leave this pin floating if external clock is used. Crystal input or reference clock input. Power-down pin: Active LOW. If PD# = 0, the PLL and Xtal are powered down, and outputs are weakly pulled low. Output Enable pin: Active HIGH. If OE = 1, SSCLK and REFCLK are enabled. User has the option of choosing either PD# or OE function. Power supply ground. Buffered reference output. Spread spectrum clock output. Spread spectrum control. 0 = Spread on. 1 = Spread off. The spread% is programmed to either center spread or down spread with various spread percentages. The range for center spread is from 0.25% to 2.50%. The range for down spread is from -0.5% to -5.0%. Contact the factory for smaller or larger spread % amounts if required. The input to the CY25100 can be either a crystal or a clock signal. The input frequency range for crystals is 8-30 MHz, and for clock signals is 8-166 MHz. The CY25100 has two clock outputs, REFCLK and SSCLK. The non-spread spectrum REFCLK output has the same frequency as the input of the CY25100. The frequency modulated SSCLK output can be programmed from 3-200 MHz. The CY25100 products are available in an 8-pin SOIC and TSSOP packages with commercial and industrial operating temperature ranges. Description
5 6 7 8
VSS REFCLK SSCLK SSON#
General Description
The CY25100 is a Spread Spectrum Clock Generator (SSCG) IC used for the purpose of reducing EMI found in today's high-speed digital electronic systems. The device uses a Cypress proprietary PLL and Spread Spectrum Clock (SSC) technology to synthesize and modulate the frequency of the input clock. By frequency modulating the clock, the measured EMI at the fundamental and harmonic frequencies are greatly reduced. This reduction in radiated energy can significantly reduce the cost of complying with regulatory agency (EMC) requirements and improve time-to-market without degrading system performance. The CY25100 uses a factory/field-programmable configuration memory array to synthesize output frequency, spread%, crystal load capacitor, reference clock output on/off, spread spectrum on/off function and PD#/OE options. Table 1. Pin Function Pin Name Pin# Unit Program Value Input Frequency XIN and XOUT 3 and 2 MHz Total Xtal Load Capacitance XIN and XOUT 3 and 2 pF Output Frequency SSCLK 7 MHz ENTER DATA
Spread Percent (0.5% - 5%, 0.25% Intervals) SSCLK 7 % ENTER DATA
Reference Output REFOUT 6 On or Off ENTER DATA
Power-down or Output Enable PD#/OE 4 Select PD# or OE ENTER DATA
Frequency Modulation SSCLK 7 kHz 31.5
ENTER DATA ENTER DATA
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CY25100
Programming Description
Field-Programmable CY25100 The CY25100 is programmed at the package level, i.e., in a programmer socket. The CY25100 is flash-technology based, so the parts can be reprogrammed up to 100 times. This allows for fast and easy design changes and product updates, and eliminates any issues with old and out-of-date inventory. Samples and small prototype quantities can be programmed on the CY3672 programmer with CY3690 (TSSOP) or CY3691 (SOIC) socket adapter. CyberClocks Online Software CyberClocks Online Software is a web-based software application that allows the user to custom-configure the CY25100. All the parameters in Table 1 given as "Enter Data" can be programmed into the CY25100. CyberClocks Online outputs an industry-standard JEDEC file used for programming the CY25100. CyberClocksOnline is available at www.cyberclocksonline.com website through user registration. To register, fillout the registration form and make sure to check the "non-standard devices" box. For more information on the registration process refer to CY3672 datasheet For information regarding Spread Spectrum software programming solutions, please contact your local Cypress Sales or Field Application Engineer (FAE), representative for details. CY3672 FTG Programming Kit and CY3690/CY3691 Socket Adapter The Cypress CY3672 FTG programmer and CY3690/CY3691 Socket Adapter are needed to program the CY25100. The CY3690 enables user to program CY25100ZCF and CY25100ZIF (TSSOP) and CY3691 gives the user the ability to program CY25100SCF and CY25100SIF (SOIC). Each socket adapter comes with small prototype quantities of CY25100. The CY3690/CY3691 is a separate orderable item, so the existing users of the CY3672 FTG development kit or CY3672-PRG programmer need to order only the socket adapters to program the CY25100. Factory-Programmable CY25100 Factory programming is available for volume manufacturing by Cypress. All requests must be submitted to the local Cypress Field Application Engineer (FAE) or sales representative. A sample request form (refer to "CY25100 Sample Request Form" at www.cypress.com) must be completed. Once the request has been processed, you will receive a new part number, samples, and data sheet with the programmed values. This part number will be used for additional sample requests and production orders. Additional information on the CY25100 can be obtained from the Cypress web site at www.cypress.com.
Product Functions
Input Frequency (XIN, pin 3 and XOUT, pin 2) The input to the CY25100 can be a crystal or a clock. The input frequency range for crystals is 8 to 30 MHz, and for clock signals is 8 to 166 MHz. CXIN and CXOUT (pin 3 and pin 2) The load capacitors at Pin 1 (CXIN) and Pin 8 (CXOUT) can be programmed from 12 pF to 60 pF with 0.5-pF increments. The programmed value of these on-chip crystal load capacitors are the same (XIN = XOUT = 12 to 60 pF). The required values of CXIN and CXOUT can be calculated using the following formula: CXIN = CXOUT = 2CL - CP where CL is the crystal load capacitor as specified by the crystal manufacturer and CP is the parasitic PCB capacitance. For example, if a fundamental 16-MHz crystal with CL of 16-pF is used and CP is 2 pF, CXIN and CXOUT can be calculated as: CXIN = CXOUT = (2 x 16) - 2 = 30 pF. If using a driven reference, set CXIN and CXOUT to the minimum value 12 pF. Output Frequency, SSCLK Output (SSCLK, pin 7) The modulated frequency at the SSCLK output is produced by synthesizing the input reference clock. The modulation can be stopped by SSON# digital control input (SSON# = HIGH, no modulation). If modulation is stopped, the clock frequency is the nominal value of the synthesized frequency without modulation (spread % = 0). The range of synthesized clock is from 3-200 MHz. Spread Percentage (SSCLK, pin 7) The SSCLK spread can be programmed at any percentage value from 0.25% to 2.5% for Center Spread and from -0.5% to -5.0% Down Spread. Reference Output (REFOUT, pin 6) The reference clock output has the same frequency and the same phase as the input clock. This output can be programmed to be enabled (clock on) or disabled (High-Z, clock off). If this output is not needed, it is recommended that users request the disabled (High-Z, Clock Off) option. Frequency Modulation The frequency modulation is programmed at 31.5 kHz for all SSCLK frequencies from 3 to 200 MHz. Contact the factory if a higher-modulation frequency is required. Power-down or Output Enable (PD# or OE, pin 4): The part can be programmed to include either PD# or OE function. PD# function powers down the oscillator and PLL. The OE function disables the outputs.
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CY25100
Absolute Maximum Rating
Supply Voltage (VDD) ........................................-0.5 to +7.0V DC Input Voltage...................................... -0.5V to VDD + 0.5 Storage Temperature (Non-condensing)..... -55C to +125C Junction Temperature ................................ -40C to +125C Data Retention @ Tj = 125C................................> 10 years Package Power Dissipation...................................... 350 mW Static Discharge Voltage.......................................... > 2000V (per MIL-STD-883, Method 3015) Comments Parallel resonance, fundamental mode, AT cut Internal load caps Fundamental mode Min. Typ. Max. Unit 8 6 - 3 - - - - - 0.5 30 30 25 - 2 MHz pF - mW
Recommended Crystal Specifications
Parameter FNOM CLNOM R1 R3/R1 DL Description Nominal Crystal Frequency Nominal Load Capacitance Equivalent Series Resistance (ESR)
Ratio of Third Overtone Mode ESR to Ratio used because typical R1 values are much Fundamental Mode ESR less than the maximum spec Crystal Drive Level No external series resistor assumed
Operating Conditions
Parameter VDD TA CLOAD Fref Supply Voltage Ambient Commercial Temperature Ambient Industrial Temperature Max. Load Capacitance @ pin 6 and pin 7 External Reference Crystal (Fundamental tuned crystals only) External Reference Clock FSSCLK FREFCLK FMOD TPU SSCLK output frequency, CLOAD = 15 pF REFCLK output frequency, CLOAD = 15 pF Spread Spectrum Modulation Frequency Power-up time for all VDDs to reach minimum specified voltage (power ramp must be monotonic) Description Min. 3.13 0 -40 - 8 8 3 8 30.0 0.05 Typ. 3.30 - - - - - - - 31.5 - Max. 3.45 70 85 15 30 166 200 166 33.0 500 Unit V C C pF MHz MHz MHz MHz kHz ms
DC Electrical Characteristics
Parameter
IOH IOL VIH VIL IIH IIL IOZ CXIN or CXOUT[1] CIN[1] IVDD IDDS
Description
Output High Current Output Low Current Input High Voltage Input Low Voltage Input High Current, PD#/OE and SSON# pins Input Low Current, PD#/OE and SSON# pins Output Leakage Current
Condition
VOH = VDD - 0.5, VDD = 3.3V (source) VOL = 0.5, VDD= 3.3V (sink) CMOS levels, 70% of VDD CMOS levels, 30% of VDD Vin = VDD Vin = VSS Three-state output, PD#/OE = 0
Min.
10 10 0.7VDD - - - -10 - - - - -
Typ.
12 12 - - - -
Max.
Unit
mA mA
VDD 0.3VDD 10 10 10
V V A A A pF pF pF mA A
Programmable Capacitance at pin Capacitance at minimum setting 2 and pin 3 Capacitance at maximum setting Input Capacitance at pin 4 and pin Input pins excluding XIN and XOUT 8 Supply Current Standby current VDD = 3.45V, Fin = 30 MHz, REFCLK = 30 MHz, SSCLK = 66 MHz, CLOAD = 15 pF, PD#/OE = SSON# = VDD VDD = 3.45V, Device powered down with PD# = 0V (driven reference pulled down)
12 60 5 25 15
- - 7 35 30
Notes: 1. Guaranteed by characterization, not 100% tested.
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CY25100
AC Electrical Characteristics[1]
Parameter DC Description Output Duty Cycle Output Duty Cycle SR1 SR2 SR3 SR4 TCCJ1[2] Rising Edge Slew Rate Falling Edge Slew Rate Rising Edge Slew Rate Falling Edge Slew Rate Cycle-to-Cycle Jitter SSCLK (Pin 7) Cycle-to-Cycle Jitter SSCLK (Pin 7) Cycle-to-Cycle Jitter REFCLK (Pin 6) Power-down Time (pin 4 = PD#) Output Disable Time (pin 4 = OE) Output Enable Time (pin 4 = OE) Power-up Time, Crystal is used Power-up Time, Reference clock is used Condition SSCLK, Measured at VDD/2 REFCLK, Measured at VDD/2 Duty Cycle of CLKIN = 50% at input bias SSCLK from 3 to 100 MHz; REFCLK from 3 to 100 MHz. 20%-80% of VDD SSCLK from 3 to 100 MHz; REFCLK from 3 to 100 MHz. 80%-20% of VDD SSCLK from 100 to 200 MHz; REFCLK from 100 to 166 MHz 20%-80% of VDD SSCLK from 100 to 200 MHz; REFCLK from 100 to 166 MHz 80%-20% of VDD CLKIN = SSCLK = 166 MHz, 2% spread, REFCLK off CLKIN = SSCLK = 66 MHz, 2% spread, REFCLK off CLKIN = SSCLK = 33 MHz, 2% spread, REFCLK off TCCJ2[2] CLKIN = SSCLK = 166 MHz, 2% spread, REFCLK on CLKIN = SSCLK = 66 MHz, 2% spread, REFCLK on CLKIN = SSCLK = 33 MHz, 2% spread, REFCLK on TCCJ3
[2]
Min. 45 40 0.7 0.7 1.2 1.2 - - - - - - - - - - - - - -
Typ. 50 50 1.1 1.1 1.6 1.6 90 100 130 100 105 200 80 100 135 150 150 150 3.5 2
Max. 55 60 3.6 3.6 4.0 4.0 120 130 170 130 140 260 100 130 180 350 350 350 5 3
Unit % % V/ns V/ns V/ns V/ns ps ps ps ps ps ps ps ps ps ns ns ns ms ms
CLKIN = SSCLK = 166 MHz, 2% spread, REFCLK on CLKIN = SSCLK = 66 MHz, 2% spread REFCLK on CLKIN = SSCLK = 33 MHz, 2% spread, REFCLK on Time from falling edge on PD# to stopped outputs (Asynchronous) Time from falling edge on OE to stopped outputs (Asynchronous) Time from rising edge on OE to outputs at a valid frequency (Asynchronous) Time from rising edge on PD# to outputs at valid frequency (Asynchronous) Time from rising edge on PD# to outputs at valid frequency (Asynchronous), reference clock at correct frequency
tSTP TOE1 TOE2 tPU1 tPU2
Application Circuit[3, 4, 5]
Pow er
1 0 .1 u F 2
VDD
SSON#
8
XOUT
SSCLK
7
CY25100
3 X IN /C L K IN REFCLK 6
VDD
4
P D # /O E
VSS
5
2. Jitter is configuration dependent. Actual jitter is dependent on XIN jitter and edge rate, number of active outputs, output frequencies, spread percentage, temperature, and output load. For more information, refer to the application note, "Jitter in PLL Based Systems: Causes, Effects, and Solutions" available at http://www.cypress.com/clock/appnotes.html, or contact your local Cypress Field Application Engineer. 3. Since the load capacitors (CXIN and CXOUT) are provided by the CY25100, no external capacitors are needed on the XIN and XOUT pins to match the crystal load capacitor (CL). Only a single 0.1-F bypass capacitor is required on the VDD pin. 4. If an external clock is used, apply the clock to XIN (pin 3) and leave XOUT (pin 2) floating (unconnected). 5. If SSON# (pin 8) is LOW (VSS), the frequency modulation will be on at SSCLK pin (pin 7).
Document #: 38-07499 Rev. *D
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CY25100
Switching Waveforms
Duty Cycle Timing (DC = t1A/t1B)
OUTPUT t1A t1B
Output Rise/Fall Time (SSCLK and REFCLK)
VDD 0V
Tr Tf Output Rise time (Tr) = (0.6 x VDD)/SR1 (or SR3) Output Fall time (Tf) = (0.6 x VDD)/SR2 (or SR4) Refer to AC Electrical Characteristics table for SR (Slew Rate) values.
OUTPUT
Power-down Timing and Power-up Timing
POWERDOWN VDD 0V VIL VIH tPU
(Asynchronous)
CLKOUT tSTP
High Impedance
Output Enable/Disable Timing
OUTPUT ENABLE VDD 0V VIL VIH TOE2
(Asynchronous)
CLKOUT TOE1
High Impedance
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CY25100
Informational Graphs [6]
172.5 171.5 170.5 169.5 168.5 167.5 166.5 165.5 164.5 163.5 162.5 161.5 160.5 159.5
0 20 40 60 80 100 120 Time (us) 140 160 180 200
Spread Spectrum Profile: Fnom=166MHz, Fmod=30kHz, Spread%= -4%
Fnominal
169.5 169 168.5 168 167.5 167 166.5 166 165.5 165 164.5 164 163.5 163 162.5
0 20
Spread Spectrum Profile: Fnom=166MHz, Fmod=30kHz, Spread%= +/-1%
Fnominal
40
60
80
100 120 Time (us)
140
160
180
200
68.5 68 67.5 67 66.5 66 65.5 65 64.5 64 63.5
0 20
Spread Spectrum Profile: Fnom=66MHz, Fmod=30kHz, Spread%= -4%
67.5 67 66.5
Fnominal
Spread Spectrum Profile: Fnom=66MHz, Fmod=30kHz, Spread%= +/-1%
66 65.5 65 64.5
Fnominal
40
60
80
100 120 Time (us)
140
160
180
200
0
20
40
60
80
100 120 Time (us)
140
160
180
200
Duty Cycle vs. REFCLK
( C L OA D =1 5 p F )
IDD vs. SSCLK
Te m pe r atu r e =25C, V DD=3.3V , CLOAD=15p F, SS off, Re fclk = 30M Hz 30 25 IDD (m A) 20 15 10 5
60 58 56 54 52 50 48 46 44 42 40 0 50 100 REFCLK (MHz) 150 200
Duty Cycle (%)
0 0 50 100 SSCLK (M Hz ) 150 200
Note: 6. The "Informational Graphs" are meant to convey the typical performance levels. No performance specifications is implied or guaranteed. Refer to the tables on pages 4 and 5 for device specifications.
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CY25100
Informational Graphs (continued)[6]
Measured Spread% vs. VDD over Tem perature (Target Spread = 0.5%, Fout=100MHz, CLOAD=15pF) 0.60% Spread% 0.55% 0.50% 0.45% 0.40% 2.7 3 3.3 VDD (V) 3.6 3.9
Measured Spread% vs. VDD over Tem perature (Target Spread = 5.0%, Fout=100MHz, CLOAD=15pF) 6.00% Spread% 5.50% 5.00% 4.50% 4.00% 2.7 3 3.3 VDD (V) 3.6 3.9 -40C 25C 85C
-40C 25C 85C
SSCLK Attenuation vs. VDD over Tem perature (Measured at 7th Harmonic w ith Fnom=100MHz and Spread=0.5%, CLOAD=15pF) 0 -2 -4 -6 -8 -10 2.7 3 3.3 VDD (V) 3.6 3.9 -40C 25C 85C
SSCLK Attenuation vs. VDD over Tem perature (Measured at 7th Harmonic w ith Fnom=100MHz and Spread=5.0%, CLOAD=15pF) -10 -12 -14 -16 -18 -20 2.7 3 3.3 VDD (V) 3.6 3.9
Attenuation (dB)
Attenuation (dB)
-40C 25C 85C
SSCLK EMI Attenuation vs. Spread% (Measured at 7th Harmonic Temp=25C, VDD=3.3V, SSCLK=100MHz, Measured on Cypress Characterization board w ith CLOAD=15pF)
0
Max Cycle-Cycle Jitter on SSCLK vs. Tem perature (SSCLK=100MHz, VDD=3.3V, CLOAD=15pF, +/2%spread, REFCLK off)
200 175 150 125 100 75 50 25 0 -40 - 20 0 20 40 60 80 100
Attenuation (dB)
-2 -4 -8 -10 -12 -14 -16 0.0% 0.5% 1.0% 1.5% 2.0% 2.5% 3.0% 3.5% 4.0% 4.5% 5.0% -6
Spread %
Jitter (ps)
Tem perature (deg C)
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CY25100
Ordering Information
Part Number[7] CY25100SCF CY25100SXCF CY25100SIF CY25100SXIF CY25100ZCF CY25100ZXCF CY25100ZIF CY25100ZXIF CY25100SXC-XXXW CY25100SXI-XXXW CY25100ZXC-XXXW CY25100ZXI-XXXW CY3672 CY3672-PRG CY3690 CY3691 Package description 8-pin Small Outline Integrated Circuit(SOIC) 8-pin Small Outline Integrated Circuit (SOIC) - Lead Free 8-pin Small Outline Integrated Circuit (SOIC) 8-pin Small Outline Integrated Circuit (SOIC) - Lead Free 8-pin Thin Shrunk Small Outline Package (TSSOP) 8-pin Thin Shrunk Small Outline Package (TSSOP) - Lead Free 8-pin Thin Shrunk Small Outline Package (TSSOP) 8-pin Thin Shrunk Small Outline Package (TSSOP)- Lead Free 8-pin Small Outline Integrated Circuit (SOIC)- Lead Free 8-pin Small Outline Integrated Circuit (SOIC)- Lead Free 8-pin Thin Shrunk Small Outline Package (TSSOP)- Lead Free 8-pin Thin Shrunk Small Outline Package (TSSOP)- Lead Free FTG Development Kit FTG programmer CY25100ZCF Socket adapter (TSSOP) CY25100SCF Socket adapter (SOIC) Product Flow Commercial, 0 to 70C Commercial, 0 to 70C Industrial, -40 to 85C Industrial, -40 to 85C Commercial, 0 to 70C Commercial, 0 to 70C Industrial, -40 to 85C Industrial, -40 to 85C Commercial, 0 to 70C Commercial, 0 to 70C Industrial, -40 to 85C Industrial, -40 to 85C Commercial, 0 to 70C Industrial, -40 to 85C n/a n/a n/a n/a
CY25100SXC-XXXWT 8-pin Small Outline Integrated Circuit (SOIC) - Tape and Reel- Lead Free CY25100SXI-XXXWT 8-pin Small Outline Integrated Circuit (SOIC)-Tape and Reel- Lead Free
CY25100ZXC-XXXWT 8-pin Thin Shrunk Small Outline Package (TSSOP)-Tape and Reel- Lead Free Commercial, 0 to 70C CY25100ZXI-XXXWT 8-pin Thin Shrunk Small Outline Package (TSSOP)-Tape and Reel- Lead Free Industrial, -40 to 85C
Package Diagrams
8 Lead (150 Mil) SOIC - S08 (150-Mil) SOIC S8 8-lead
PIN 1 ID
4
1
1. DIMENSIONS IN INCHES[MM] MIN. MAX. 2. PIN 1 ID IS OPTIONAL, ROUND ON SINGLE LEADFRAME RECTANGULAR ON MATRIX LEADFRAME 3. REFERENCE JEDEC MS-012
0.230[5.842] 0.244[6.197]
0.150[3.810] 0.157[3.987]
4. PACKAGE WEIGHT 0.07gms
PART # S08.15 STANDARD PKG. 5 8 SZ08.15 LEAD FREE PKG.
0.189[4.800] 0.196[4.978]
SEATING PLANE
0.010[0.254] 0.016[0.406]
X 45
0.061[1.549] 0.068[1.727] 0.004[0.102] 0.050[1.270] BSC 0.004[0.102] 0.0098[0.249] 0~8 0.0075[0.190] 0.0098[0.249]
0.016[0.406] 0.035[0.889]
0.0138[0.350] 0.0192[0.487]
51-85066-*C
Note: 7. "XXX" denotes the assigned product dash number. "W" denotes the different programmed frequency and/or spread % options.
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CY25100
Package Diagrams (continued)
8-Lead Thin Shrunk Small Outline Package (4.40 MM Body) Z8
PIN 1 ID
1
DIMENSIONS IN MM[INCHES] MIN. MAX.
6.25[0.246] 6.50[0.256] 4.30[0.169] 4.50[0.177]
8
0.19[0.007] 0.30[0.012]
0.65[0.025] BSC. 1.10[0.043] MAX.
0.25[0.010] BSC GAUGE PLANE 0-8
0.85[0.033] 0.95[0.037] 2.90[0.114] 3.10[0.122]
0.076[0.003] 0.05[0.002] 0.15[0.006] SEATING PLANE 0.50[0.020] 0.70[0.027] 0.09[[0.003] 0.20[0.008]
51-85093-*A
CyberClocks is a trademark of Cypress Semiconductor. All product and company names mentioned in this document are the trademarks of their respective holders.
Document #: 38-07499 Rev. *D
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(c) Cypress Semiconductor Corporation, 2004. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
CY25100
Document History Page
Document Title: CY25100 Field-and Factory-Programmable Spread Spectrum Clock Generator for EMI Reduction Document Number: 38-07499 REV. ** *A *B *C *D ECN NO. 126578 128753 130342 204121 215392 Issue Date 06/27/03 08/29/03 12/02/03 See ECN See ECN Orig. of Change CKN IJATMP RGL RGL RGL New Data Sheet Changes to reflect field programmability Changes to Application Circuit diagram and correction to the package description listed under the Ordering Information table for CY3690 and CY3691. Add Industrial Temperature Range Corrected the Ordering Information to match the DevMaster Added Lead Free devices Description of Change
Document #: 38-07499 Rev. *D
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